Robotic manipulation of adhesive droplets for applications in microassembly

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

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Author(s)

Detail(s)

Original languageEnglish
Title of host publication2009 IEEE International Conference on Information and Automation, ICIA 2009
Pages1562-1567
Publication statusPublished - 2009
Externally publishedYes

Conference

Title2009 IEEE International Conference on Information and Automation, ICIA 2009
PlaceChina
CityZhuhai, Macau
Period22 - 25 June 2009

Abstract

Assembly and attachment of microparts are of fundamental importance in the development of threedimensional complex microsystems. Adhesive bonding is an important method to assembly micromachining parts. We present an approach to manipulate micron size adhesive droplets for use in robotic microassembly. A micro-probe is developed and bonded to a micro-robot. Adhesive droplets are picked up from adhesive reservoir, and placed on target spots. The effect of surface energy is considered in the design of the micro-probe. The size of manipulated adhesive droplet is determined from the dimension of the micro-probe tip. Experiments were conducted to manipulate adhesive droplets, and assemble three-dimensional micro-mirrors. © 2009 IEEE.

Citation Format(s)

Robotic manipulation of adhesive droplets for applications in microassembly. / Wang, Lidai; Mills, James K.; Cleghorn, William L.
2009 IEEE International Conference on Information and Automation, ICIA 2009. 2009. p. 1562-1567 5205166.

Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review