Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)2204-2206
Journal / PublicationApplied Physics Letters
Volume68
Issue number16
Publication statusPublished - 15 Apr 1996
Externally publishedYes

Abstract

In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn 5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface at the bottom of the solder joint. It suggests that gravity plays a role. © 1996 American Institute of Physics. [S0003-6951(96)02316-9].

Citation Format(s)

Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers. / Kim, H. K.; Tu, K. N.; Totta, P. A.

In: Applied Physics Letters, Vol. 68, No. 16, 15.04.1996, p. 2204-2206.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review