RF MEMS switches for Wide I/O data bus applications

Michael B. Cohn; Kaosio Saechao; Michael Whitlock; Daniel Brenman; K. S. Tang Wallace; Robert M. Proie Jr.

doi:10.1109/TEST.2013.6651889

RF MEMS switches for Wide I/O data bus applications

Michael B. Cohn, Kaosio Saechao, Michael Whitlock, Daniel Brenman, K. S. Tang Wallace, Robert M. Proie Jr.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

8 Citations (Scopus)

Abstract

Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of

Original language	English
Title of host publication	Proceedings - International Test Conference
DOIs	https://doi.org/10.1109/TEST.2013.6651889
Publication status	Published - 2013
Externally published	Yes
Event	44th IEEE International Test Conference, ITC 2013 - Anaheim, CA, United States Duration: 10 Sept 2013 → 12 Sept 2013

Publication series

Name
ISSN (Print)	1089-3539

Conference

Conference	44th IEEE International Test Conference, ITC 2013
Place	United States
City	Anaheim, CA
Period	10/09/13 → 12/09/13

Research Keywords

ATE
MEMS Switch
Relay
Switch Matrix
TSV
Wide I/O

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abstract = "Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of",

keywords = "ATE, MEMS Switch, Relay, Switch Matrix, TSV, Wide I/O",

author = "Cohn, {Michael B.} and Kaosio Saechao and Michael Whitlock and Daniel Brenman and Wallace, {K. S. Tang} and {Proie Jr.}, {Robert M.}",

year = "2013",

doi = "10.1109/TEST.2013.6651889",

language = "English",

isbn = "9781479908592",

booktitle = "Proceedings - International Test Conference",

note = "44th IEEE International Test Conference, ITC 2013 ; Conference date: 10-09-2013 Through 12-09-2013",

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TY - GEN

T1 - RF MEMS switches for Wide I/O data bus applications

AU - Cohn, Michael B.

AU - Saechao, Kaosio

AU - Whitlock, Michael

AU - Brenman, Daniel

AU - Wallace, K. S. Tang

AU - Proie Jr., Robert M.

PY - 2013

Y1 - 2013

N2 - Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of

AB - Wide I/O poses serious challenges due to the requisite high density of electronics and relays near the DUT, as well as high bandwidth. A 2×2mm MEMS switch has been demonstrated, offering >80% footprint reduction relative to a typical TO-can electromagnetic relay. A further benefit of its small size, the MEMS relay is able to operate up to Ka-band (40 GHz) with hot switch capability and repeatability of

KW - ATE

KW - MEMS Switch

KW - Relay

KW - Switch Matrix

KW - TSV

KW - Wide I/O

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84891528912&origin=recordpage

U2 - 10.1109/TEST.2013.6651889

DO - 10.1109/TEST.2013.6651889

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781479908592

BT - Proceedings - International Test Conference

T2 - 44th IEEE International Test Conference, ITC 2013

Y2 - 10 September 2013 through 12 September 2013

ER -

RF MEMS switches for Wide I/O data bus applications

Abstract

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Research Keywords

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