Revolutionizing flexible electronics with liquid metal innovations

Zhiwei Lin, Tong Li, Siyan Yang, Bingqiang Ji, Zuankai Wang*

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

11 Citations (Scopus)

Abstract

Liquid metals have recently made substantial breakthroughs in flexible electronics. This perspective elaborates on liquid metals in flexible electronic devices. Here, we summarize the latest innovations of flexible, liquid-metal-based electronic devices in fabrication methods and applications and evaluate the present status and future outlook. We aim to identify the challenges and opportunities of liquid metals in flexible electronic devices and provide insights into the future research direction of the field. © 2024 Elsevier Inc.
Original languageEnglish
Article number100331
JournalDevice
Volume2
Issue number5
Online published17 May 2024
DOIs
Publication statusPublished - 17 May 2024

Funding

We acknowledge financial support from the Shenzhen Science and Technology Innovation Council (Shenzhen Key Project no. JCYJ20200109143206663 , no. SGDX2020110309300502 ), the National Natural Science Foundation of China (no. T2293694 , no. 51975502 ), the Research Grants Council of Hong Kong (no. 11213320 , no. C1006-20W , no. SRFS2223-1S01 ), and the Innovation and Technology Council of Hong Kong (no. GHP/092/20GD ).

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