Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration'" [Appl. Phys. Lett. 79, 1061 (2001)]

K. N. Tu

doi:10.1063/1.1386625

Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration'" [Appl. Phys. Lett. 79, 1061 (2001)]

K. N. Tu^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › Comment/debate

8 Citations (Scopus)

Original language	English
Pages (from-to)	1063
Journal	Applied Physics Letters
Volume	79
Issue number	7
DOIs	https://doi.org/10.1063/1.1386625
Publication status	Published - 13 Aug 2001
Externally published	Yes

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JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 7

ER -

Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration'" [Appl. Phys. Lett. 79, 1061 (2001)]

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