TY - GEN
T1 - Residual strength of OLB in a TAB assembly with ACF after thermal and mechanical loading
AU - Wu, C. M.L.
AU - Yeung, N. H.
AU - Chau, M. L.
AU - Lai, J. K.L.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1998
Y1 - 1998
N2 - The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment.
AB - The key parameters of temperature, pressure, and time during bonding of the outer lead bonds (OLB) in a tape automated bonding (TAB) assembly with anisotropic conductive film (ACF) were investigated. In our study, thermal aging and thermal shock treatments were used to evaluate their reliability. Also, peel tests and microstructural examinations were conducted. It was found that the peel strength decreased slightly with the bonding temperature and bonding pressure. However, peel strength seemed to be stable with bonding time. In the aging test, the results showed that the peel strength decreased as the aging time increased. Moreover, results from scanning electron microscopy (SEM) showed that some voids were revealed near the TAB polyimide in the thermal shock treatment.
UR - https://www.scopus.com/pages/publications/0005692231
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-0005692231&origin=recordpage
U2 - 10.1109/ADHES.1998.742044
DO - 10.1109/ADHES.1998.742044
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 0780349342
SN - 9780780349346
VL - 1998-September
T3 - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
SP - 295
EP - 298
BT - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PB - IEEE
T2 - 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
Y2 - 28 September 1998 through 30 September 1998
ER -