@inproceedings{1b5b9bbe16954180b676e92058cb07e8,
title = "Research on the Interfacial Reaction between Anisotropically Conductive Film and Bumpless Die",
abstract = "This paper systematically discusses the influence of bonding pressure, bonding temperature and humidity on the adhesion strength of bumpless die (aluminum surface) with two kinds of Anisotropically Conductive Films (ACFs). Evaluated by die shear test, the adhesion strength between the ACFs and aluminum is not affected seriously by bonding pressure but it increases while bonding temperature increases. Adhesion strength at the ACF/aluminum interface increases while the adhesion at the ACF/glass surface decreases after aging in the same high temperature and high humidity environment. For ACF/aluminum layer, the adhesion enhancement mechanism after humidity aging is discussed by the research results of SAM, SEM \& EDX, and XPS. Moisture mainly diffused into aluminum and resulted in oxidation reaction instead of diffusing into adhesive to make it swell. Fewer swelling of adhesive, fewer delaminations occured at the ACF/aluminum surface. So the adhesion strength of shear samples increased after temperature/humidity exposure. In addition, the oxidation reaction can provide fresh rougher surface that may enhance adhesion strength.",
keywords = "Adhesion, Aluminum, Anisotropically conductive film (ACF), Bumpless die, Interfacial reaction",
author = "Zhang, \{J. H.\} and Chan, \{Y. C.\} and Zeng, \{Z. M.\} and Chiu, \{Y. W.\}",
year = "2002",
month = may,
doi = "10.1109/ECTC.2002.1008316",
language = "English",
isbn = "0-7803-7430-4",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1569--1574",
booktitle = "2002 PROCEEDINGS - 52nd ELECTRONIC COMPONENTS \& TECHNOLOGY CONFERENCE",
note = "52nd Electronic Components and Technology Conference (ECTC 2002) ; Conference date: 28-05-2002 Through 31-05-2002",
}