Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

J. H. Zhang; Y. C. Chan

doi:10.1007/s11664-003-0214-z

Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

J. H. Zhang, Y. C. Chan^*

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

33 Citations (Scopus)

Abstract

Functional degradation mechanism in anisotropically conductive films (ACF) interconnection using very-low-height Ni-bumped chips was discussed. Reliability of ACF flip-chip-on-flex (FCOF) was evaluated by measuring contact resistance changes. Results showed degradation of contact resistance and electrical failure in the ACF interconnection.

Original language	English
Pages (from-to)	228-234
Journal	Journal of Electronic Materials
Volume	32
Issue number	4
DOIs	https://doi.org/10.1007/s11664-003-0214-z
Publication status	Published - Apr 2003

Research Keywords

Anisotropically conductive adhesive or film
Coefficient of thermal expansion
Contact resistance
Degradation mechanism
Flip chip
Oxide formation
Reliability

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10.1007/s11664-003-0214-z

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title = "Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications",

abstract = "Functional degradation mechanism in anisotropically conductive films (ACF) interconnection using very-low-height Ni-bumped chips was discussed. Reliability of ACF flip-chip-on-flex (FCOF) was evaluated by measuring contact resistance changes. Results showed degradation of contact resistance and electrical failure in the ACF interconnection.",

keywords = "Anisotropically conductive adhesive or film, Coefficient of thermal expansion, Contact resistance, Degradation mechanism, Flip chip, Oxide formation, Reliability",

author = "Zhang, {J. H.} and Chan, {Y. C.}",

year = "2003",

month = apr,

doi = "10.1007/s11664-003-0214-z",

language = "English",

volume = "32",

pages = "228--234",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

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Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications. / Zhang, J. H.; Chan, Y. C.
In: Journal of Electronic Materials, Vol. 32, No. 4, 04.2003, p. 228-234.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

TY - JOUR

T1 - Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

AU - Zhang, J. H.

AU - Chan, Y. C.

PY - 2003/4

Y1 - 2003/4

N2 - Functional degradation mechanism in anisotropically conductive films (ACF) interconnection using very-low-height Ni-bumped chips was discussed. Reliability of ACF flip-chip-on-flex (FCOF) was evaluated by measuring contact resistance changes. Results showed degradation of contact resistance and electrical failure in the ACF interconnection.

AB - Functional degradation mechanism in anisotropically conductive films (ACF) interconnection using very-low-height Ni-bumped chips was discussed. Reliability of ACF flip-chip-on-flex (FCOF) was evaluated by measuring contact resistance changes. Results showed degradation of contact resistance and electrical failure in the ACF interconnection.

KW - Anisotropically conductive adhesive or film

KW - Coefficient of thermal expansion

KW - Contact resistance

KW - Degradation mechanism

KW - Flip chip

KW - Oxide formation

KW - Reliability

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U2 - 10.1007/s11664-003-0214-z

DO - 10.1007/s11664-003-0214-z

M3 - RGC 21 - Publication in refereed journal

SN - 0361-5235

VL - 32

SP - 228

EP - 234

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 4

ER -

Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

Abstract

Research Keywords

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