Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects
- Sha Xu
- , Xiaoxin Zhu
- , Hiren Kotadia
- , Hua Lu
- , Samjid H. Mannan
- , Chris Bailey
- , Y. C. Chan*
*Corresponding author for this work
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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