TY - GEN
T1 - Remedies to control electromigration
T2 - 62nd IEEE Electronic Components and Technology Conference (ECTC 2012)
AU - Xu, Sha
AU - Zhu, Xiaoxin
AU - Kotadia, Hiren
AU - Lu, Hua
AU - Mannan, Samjid H.
AU - Bailey, Chris
AU - Chan, Y. C.
PY - 2012
Y1 - 2012
N2 - Electromigration is a critical reliability problem in electronic industry, especially with the shrinkage and downscaling of microelectronic feature size, which results in gradual increase of current density. Carbon nanotube(CNT) doping is adopted in this paper. CNT has demonstrated high electromigration resistance. In our work, CNT doping is combined with SAC interconnects. A CNT after surfactant will be incorporated into SAC solder interconnection. Best percentage of CNT doping is found from this experiment, and better electromigration reliability can be observed from this work by SEM image. Moreover, the shear stress distribution is improved using computational study, which shows better mechanical properties. The combination of experimental and numerical study is highlighted in this work. © 2012 IEEE.
AB - Electromigration is a critical reliability problem in electronic industry, especially with the shrinkage and downscaling of microelectronic feature size, which results in gradual increase of current density. Carbon nanotube(CNT) doping is adopted in this paper. CNT has demonstrated high electromigration resistance. In our work, CNT doping is combined with SAC interconnects. A CNT after surfactant will be incorporated into SAC solder interconnection. Best percentage of CNT doping is found from this experiment, and better electromigration reliability can be observed from this work by SEM image. Moreover, the shear stress distribution is improved using computational study, which shows better mechanical properties. The combination of experimental and numerical study is highlighted in this work. © 2012 IEEE.
UR - https://www.scopus.com/pages/publications/84866846562
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84866846562&origin=recordpage
U2 - 10.1109/ECTC.2012.6249097
DO - 10.1109/ECTC.2012.6249097
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781467319669
SP - 1899
EP - 1904
BT - Proceedings - Electronic Components and Technology Conference
Y2 - 29 May 2012 through 1 June 2012
ER -