Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

Y. P. Wu; Yan C. Chan; J. K L Lai

doi:10.1109/ECTC.1998.678708

Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

11 Citations (Scopus)

Abstract

In this work, the effect of solder joint geometry, and diameter ratio of solder ball to pad (Ds/Dp), on the reliability of plastic ball grid array assemblies (PBGA) reflow soldered in a nitrogen ambient with oxygen content down to 50 ppm (BTU VIP-70N) is studied. Environmental stress screening such as high-low temperature and humidity cycling (TABAI, ESPEC PL-2FP), and thermal shock (air-to-air, TABAI, ESPEC TSA-70L) are deployed. The uniformity data of solder ball joints, in terms of fatigue life and mechanical shear strength (INSTRON mini44), has yielded useful results on the reproducibility of PBGA similar to typical manufacturing process conditions. All the results show that the reliability of PBGA assemblies reflowed in a nitrogen ambient are better than in a compressed air ambient. The mechanical properties of the PBGA assemblies are found to be best when Ds/Dp is close to 1.2. Theoretical models are developed to explain the experimental data. This work throws new light on major reliability issues of PBGA soldered by nitrogen reflow.

Original language	English
Title of host publication	1998 Proceedings - 48th Electronic Components and Technology Conference
Publisher	IEEE
Pages	292-296
ISBN (Print)	0-7803-4526-6, 0-7803-4527-4
DOIs	https://doi.org/10.1109/ECTC.1998.678708
Publication status	Published - May 1998
Event	1998 48th Electronic Components & Technology Conference - Seattle, WA , United States Duration: 25 May 1998 → 28 May 1998

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISSN (Print)	0569-5503

Conference

Conference	1998 48th Electronic Components & Technology Conference
Place	United States
City	Seattle, WA
Period	25/05/98 → 28/05/98

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SDG 9 Industry, Innovation, and Infrastructure

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@inproceedings{c8eca16f04ee4f7c9b48841fddde1040,

title = "Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient",

abstract = "In this work, the effect of solder joint geometry, and diameter ratio of solder ball to pad (Ds/Dp), on the reliability of plastic ball grid array assemblies (PBGA) reflow soldered in a nitrogen ambient with oxygen content down to 50 ppm (BTU VIP-70N) is studied. Environmental stress screening such as high-low temperature and humidity cycling (TABAI, ESPEC PL-2FP), and thermal shock (air-to-air, TABAI, ESPEC TSA-70L) are deployed. The uniformity data of solder ball joints, in terms of fatigue life and mechanical shear strength (INSTRON mini44), has yielded useful results on the reproducibility of PBGA similar to typical manufacturing process conditions. All the results show that the reliability of PBGA assemblies reflowed in a nitrogen ambient are better than in a compressed air ambient. The mechanical properties of the PBGA assemblies are found to be best when Ds/Dp is close to 1.2. Theoretical models are developed to explain the experimental data. This work throws new light on major reliability issues of PBGA soldered by nitrogen reflow.",

author = "Wu, {Y. P.} and Chan, {Yan C.} and Lai, {J. K L}",

year = "1998",

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doi = "10.1109/ECTC.1998.678708",

language = "English",

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address = "United States",

note = "1998 48th Electronic Components & Technology Conference ; Conference date: 25-05-1998 Through 28-05-1998",

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Wu, YP, Chan, YC & Lai, JKL 1998, Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient. in 1998 Proceedings - 48th Electronic Components and Technology Conference. Proceedings - Electronic Components and Technology Conference, IEEE, pp. 292-296, 1998 48th Electronic Components & Technology Conference, Seattle, WA , United States, 25/05/98. https://doi.org/10.1109/ECTC.1998.678708

Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient. / Wu, Y. P.; Chan, Yan C.; Lai, J. K L.
1998 Proceedings - 48th Electronic Components and Technology Conference. IEEE, 1998. p. 292-296 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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AU - Wu, Y. P.

AU - Chan, Yan C.

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N2 - In this work, the effect of solder joint geometry, and diameter ratio of solder ball to pad (Ds/Dp), on the reliability of plastic ball grid array assemblies (PBGA) reflow soldered in a nitrogen ambient with oxygen content down to 50 ppm (BTU VIP-70N) is studied. Environmental stress screening such as high-low temperature and humidity cycling (TABAI, ESPEC PL-2FP), and thermal shock (air-to-air, TABAI, ESPEC TSA-70L) are deployed. The uniformity data of solder ball joints, in terms of fatigue life and mechanical shear strength (INSTRON mini44), has yielded useful results on the reproducibility of PBGA similar to typical manufacturing process conditions. All the results show that the reliability of PBGA assemblies reflowed in a nitrogen ambient are better than in a compressed air ambient. The mechanical properties of the PBGA assemblies are found to be best when Ds/Dp is close to 1.2. Theoretical models are developed to explain the experimental data. This work throws new light on major reliability issues of PBGA soldered by nitrogen reflow.

AB - In this work, the effect of solder joint geometry, and diameter ratio of solder ball to pad (Ds/Dp), on the reliability of plastic ball grid array assemblies (PBGA) reflow soldered in a nitrogen ambient with oxygen content down to 50 ppm (BTU VIP-70N) is studied. Environmental stress screening such as high-low temperature and humidity cycling (TABAI, ESPEC PL-2FP), and thermal shock (air-to-air, TABAI, ESPEC TSA-70L) are deployed. The uniformity data of solder ball joints, in terms of fatigue life and mechanical shear strength (INSTRON mini44), has yielded useful results on the reproducibility of PBGA similar to typical manufacturing process conditions. All the results show that the reliability of PBGA assemblies reflowed in a nitrogen ambient are better than in a compressed air ambient. The mechanical properties of the PBGA assemblies are found to be best when Ds/Dp is close to 1.2. Theoretical models are developed to explain the experimental data. This work throws new light on major reliability issues of PBGA soldered by nitrogen reflow.

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ER -

Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

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