Reliability of micro-interconnects in 3D IC packages

C. Robert Kao; Albert T. Wu; King-Ning Tu; Yi-Shao Lai

doi:10.1016/j.microrel.2012.11.005

Reliability of micro-interconnects in 3D IC packages

C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai

Research output: Journal Publications and Reviews › Editorial Preface

Original language	English
Journal	Microelectronics Reliability
Volume	53
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2012.11.005
Publication status	Published - Jan 2013
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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@article{071444f7255a428e819eb2a98f32965b,

title = "Reliability of micro-interconnects in 3D IC packages",

author = "{Robert Kao}, C. and Wu, {Albert T.} and King-Ning Tu and Yi-Shao Lai",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].",

year = "2013",

month = jan,

doi = "10.1016/j.microrel.2012.11.005",

language = "English",

volume = "53",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Ltd.",

number = "1",

}

TY - JOUR

T1 - Reliability of micro-interconnects in 3D IC packages

AU - Robert Kao, C.

AU - Wu, Albert T.

AU - Tu, King-Ning

AU - Lai, Yi-Shao

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2013/1

Y1 - 2013/1

UR - http://www.scopus.com/inward/record.url?scp=84872105777&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84872105777&origin=recordpage

U2 - 10.1016/j.microrel.2012.11.005

DO - 10.1016/j.microrel.2012.11.005

M3 - Editorial Preface

SN - 0026-2714

VL - 53

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 1

ER -

Reliability of micro-interconnects in 3D IC packages

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