Reliability of ACF joint using bumpless chip after reflow process

W. K. Chiang; Y. C. Chan

doi:10.1109/AGEC.2004.1290911

Reliability of ACF joint using bumpless chip after reflow process

City University of Hong Kong

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

5 Citations (Scopus)

Abstract

The influence of reflow process to the reliability of Anisotropic Conductive Film (ACF) joint using bumpless chip was investigated. Contact resistance of ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to inherent behavior of aluminum under wet environment (corrosion-degradation). The moisture ingression into ACF can lead to unstable reliability of the joint. Moreover, ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different components' CTE and hydroscopic swelling-induced stress of epoxy. © 2004 IEEE

Original language	English
Title of host publication	Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)
Publisher	IEEE
Pages	235-239
ISBN (Print)	078038203
DOIs	https://doi.org/10.1109/AGEC.2004.1290911
Publication status	Published - 2004
Event	2004 International IEEE Conference on Asian Green Electronics (AGEC 2004) - Hong Kong, China Duration: 5 Jan 2004 → 9 Jan 2004

Conference

Conference	2004 International IEEE Conference on Asian Green Electronics (AGEC 2004)
Place	China
City	Hong Kong
Period	5/01/04 → 9/01/04

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10.1109/AGEC.2004.1290911

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title = "Reliability of ACF joint using bumpless chip after reflow process",

abstract = "The influence of reflow process to the reliability of Anisotropic Conductive Film (ACF) joint using bumpless chip was investigated. Contact resistance of ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to inherent behavior of aluminum under wet environment (corrosion-degradation). The moisture ingression into ACF can lead to unstable reliability of the joint. Moreover, ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different components' CTE and hydroscopic swelling-induced stress of epoxy. {\textcopyright} 2004 IEEE",

author = "Chiang, {W. K.} and Chan, {Y. C.}",

year = "2004",

doi = "10.1109/AGEC.2004.1290911",

language = "English",

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pages = "235--239",

booktitle = "Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)",

publisher = "IEEE",

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note = "2004 International IEEE Conference on Asian Green Electronics (AGEC 2004) ; Conference date: 05-01-2004 Through 09-01-2004",

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T1 - Reliability of ACF joint using bumpless chip after reflow process

AU - Chiang, W. K.

AU - Chan, Y. C.

PY - 2004

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N2 - The influence of reflow process to the reliability of Anisotropic Conductive Film (ACF) joint using bumpless chip was investigated. Contact resistance of ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to inherent behavior of aluminum under wet environment (corrosion-degradation). The moisture ingression into ACF can lead to unstable reliability of the joint. Moreover, ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different components' CTE and hydroscopic swelling-induced stress of epoxy. © 2004 IEEE

AB - The influence of reflow process to the reliability of Anisotropic Conductive Film (ACF) joint using bumpless chip was investigated. Contact resistance of ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to inherent behavior of aluminum under wet environment (corrosion-degradation). The moisture ingression into ACF can lead to unstable reliability of the joint. Moreover, ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different components' CTE and hydroscopic swelling-induced stress of epoxy. © 2004 IEEE

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DO - 10.1109/AGEC.2004.1290911

M3 - RGC 32 - Refereed conference paper (with host publication)

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EP - 239

BT - Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)

PB - IEEE

T2 - 2004 International IEEE Conference on Asian Green Electronics (AGEC 2004)

Y2 - 5 January 2004 through 9 January 2004

ER -

Reliability of ACF joint using bumpless chip after reflow process

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