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Relaxed silicon-germanium-on-insulator substrates by oxygen implantation into pseudomorphic silicon germanium/silicon heterostructure

  • Znenghua An
  • , Yanjun Wu
  • , Miao Zhang
  • , Zengfeng Di
  • , Chenglu Lin
  • , Ricky K. Y. Fu
  • , Peng Chen
  • , Paul K. Chu*
  • , W. Y. Cheung
  • , S. P. Wong
  • *Corresponding author for this work

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Abstract

    The development of separation-by-implantation-of-oxygen (SIMOX) process for fabricating silicon-germanium-on-insulator (SGOI) substrates by oxygen implantation into pseudomorphic silicon germanium/silicon heterostructure was discussed. Following two annealing processes (∼800 + 1350°C), a buried silicon dioxide layer was created near the original SiGe/Si interface, resulting in fully relaxed SGOI structure. It was shown that an annealing step at a moderate temperature (∼800°C) leads to less Ge loss.
    Original languageEnglish
    Pages (from-to)2452-2454
    JournalApplied Physics Letters
    Volume82
    Issue number15
    DOIs
    Publication statusPublished - 14 Apr 2003

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