Abstract
The development of separation-by-implantation-of-oxygen (SIMOX) process for fabricating silicon-germanium-on-insulator (SGOI) substrates by oxygen implantation into pseudomorphic silicon germanium/silicon heterostructure was discussed. Following two annealing processes (∼800 + 1350°C), a buried silicon dioxide layer was created near the original SiGe/Si interface, resulting in fully relaxed SGOI structure. It was shown that an annealing step at a moderate temperature (∼800°C) leads to less Ge loss.
| Original language | English |
|---|---|
| Pages (from-to) | 2452-2454 |
| Journal | Applied Physics Letters |
| Volume | 82 |
| Issue number | 15 |
| DOIs | |
| Publication status | Published - 14 Apr 2003 |
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