Relative stability of boiling of FC-72 and HFE-7100 with applications to electronic device cooling

Z. W. Liu; W. W. Lin; D. J. Lee; X. F. Peng

doi:10.1007/s11630-000-0076-0

Relative stability of boiling of FC-72 and HFE-7100 with applications to electronic device cooling

Z. W. Liu, W. W. Lin, D. J. Lee, X. F. Peng

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

2 Citations (Scopus)

Abstract

This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, q_c, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) q_c increases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.

Original language	English
Pages (from-to)	352-355
Journal	Journal of Thermal Science
Volume	9
Issue number	4
DOIs	https://doi.org/10.1007/s11630-000-0076-0
Publication status	Published - 2000
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Research Keywords

Boiling
FC-72
HFE-7100
Relative stability
Subcooling

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title = "Relative stability of boiling of FC-72 and HFE-7100 with applications to electronic device cooling",

abstract = "This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, qc, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) qc increases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.",

keywords = "Boiling, FC-72, HFE-7100, Relative stability, Subcooling",

author = "Liu, {Z. W.} and Lin, {W. W.} and Lee, {D. J.} and Peng, {X. F.}",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected]. ",

year = "2000",

doi = "10.1007/s11630-000-0076-0",

language = "English",

volume = "9",

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TY - JOUR

T1 - Relative stability of boiling of FC-72 and HFE-7100 with applications to electronic device cooling

AU - Liu, Z. W.

AU - Lin, W. W.

AU - Lee, D. J.

AU - Peng, X. F.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2000

Y1 - 2000

N2 - This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, qc, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) qc increases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.

AB - This paper investigates the relative stability between nucleate and film boiling modes of FC-72 and HFE-7100, which have potential to electronic device cooling applications. Equilibrium heat flux, qc, which refers to as an index for measuring the relative stability of boiling, was obtained at a liquid subcooling of 0-20 K. Experimental results reveal that (1) qc increases with liquid subcooling; (2) although the FC-72 exhibits a higher critical heat flux (CHF) than does the HFE-7100, somewhat unexpectedly, the equilibrium heat flux for the latter is greater than the former. Restated, at a prescribed heat flux, the risk to burnout for boiling of FC-72 is higher than that of HFE-7100. The shift in boiling curves interprets the experimental findings.

KW - Boiling

KW - FC-72

KW - HFE-7100

KW - Relative stability

KW - Subcooling

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U2 - 10.1007/s11630-000-0076-0

DO - 10.1007/s11630-000-0076-0

M3 - RGC 21 - Publication in refereed journal

SN - 1003-2169

VL - 9

SP - 352

EP - 355

JO - Journal of Thermal Science

JF - Journal of Thermal Science

IS - 4

ER -

Relative stability of boiling of FC-72 and HFE-7100 with applications to electronic device cooling

Abstract

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