Reinforced performance of lead-free Sn-8Zn-3Bi Solder With Doping of 0.03 wt.% C60 on Cu Pads
- Xiao Hu
- , Pei Qin
- , Y. C. Chan*
*Corresponding author for this work
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review