Skip to main navigation Skip to search Skip to main content

Reduction of contact resistivity by As redistribution during Pd2Si formation

  • I. Ohdomari
  • , M. Hori
  • , T. Maeda
  • , A. Ogura
  • , H. Kawarada
  • , T. Hamamoto
  • , K. Sano
  • , K. N. Tu
  • , M. Wittmer
  • , I. Kimura
  • , K. Yoneda

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

We have investigated the redistribution of uniformly doped As atoms (= 4.0×1019 cm-3) in Si during Pd2Si formation with neutron activation analysis and the influence of the redistribution on contact resistivity. Some of the uniformly doped As atoms are pushed ahead into Si near the silicide-silicon interface during Pd2Si formation at 250 °C. The amount of the redistributed As atoms increases with the thickness of Si consumed and reaches a peak concentration of 2.0×1020 cm-3. Contact resistivity is reduced from the initial values of 3.8×10-5-4.1×10-4 Ω cm2 before silicide formation, to a final value of 1.8×10-6 Ω cm2 after complete reaction. The electrically active As atoms is estimated to be 50% of the total redistributed.
Original languageEnglish
Pages (from-to)4679-4682
JournalJournal of Applied Physics
Volume54
Issue number8
DOIs
Publication statusPublished - 1 Aug 1983
Externally publishedYes

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Fingerprint

Dive into the research topics of 'Reduction of contact resistivity by As redistribution during Pd2Si formation'. Together they form a unique fingerprint.

Cite this