Redistribution of As during Pd2Si formation : Electrical measurements
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 699-705 |
Journal / Publication | Journal of Applied Physics |
Volume | 54 |
Issue number | 2 |
Publication status | Published - 1983 |
Externally published | Yes |
Link(s)
Abstract
We have investigated the redistribution of As during Pd2Si formation with electrical measurements. Our results are in agreement with the earlier findings that part of the shallow implanted As is pushed ahead by the moving silicide-silicon interface at 250°C. We show that, owing to the As redistribution, Pd2Si contacts can be formed to shallow junction diodes without altering the junction properties, because the junction is displaced by the approaching silicide-silicon interface. We also demonstrate that the increase in the As concentration beneath the silicide-silicon interface reduces contact resistance. Finally, we discuss the use of the As redistribution to adjust the barrier height of Schottky diodes and other applications in submicron integrated circuit technology.
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Citation Format(s)
Redistribution of As during Pd2Si formation: Electrical measurements. / Wittmer, M.; Ting, C. Y.; Tu, K. N.
In: Journal of Applied Physics, Vol. 54, No. 2, 1983, p. 699-705.
In: Journal of Applied Physics, Vol. 54, No. 2, 1983, p. 699-705.
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review