Recrystallization and grain growth in Ni3Al with and without boron

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)217-225
Journal / PublicationIntermetallics
Volume1
Issue number4
Publication statusPublished - 1993
Externally publishedYes

Abstract

The recrystallization and grain growth of boron-free and boron-doped (500 ppm by weight) Ni3Al polycrystals were investigated in the temperature range 700-1000°C. The levels of deformation were 17% reduction in length in compression for both alloys and 40% rolling reduction applied only to the boron-doped alloy. For alloys with or without boron, the Kolmogorov-Johnson-Mehl-Avrami relationship holds, with the Avrami exponent near unity, and the recrystallization rate is very slow. The activation energies for recrystallization are respectively 480 and 492 kJ/mol for boron-free and boron-doped to 40%. The grain growth kinetics obey a power law with the time exponent ranging from 0·2 to 0·4. The boron effect at 500 ppm was found to be small on both recrystallization and grain growth in Ni3Al. © 1993.

Research Area(s)

  • aluminides, grain growth, microalloying, recrystallization

Citation Format(s)

Recrystallization and grain growth in Ni3Al with and without boron. / Zhou, B.; Chou, Y. T.; Liu, C. T.

In: Intermetallics, Vol. 1, No. 4, 1993, p. 217-225.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review