Reconfigurable 4D printing via mechanically robust covalent adaptable network shape memory polymer

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

1 Scopus Citations
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Author(s)

  • Honggeng Li
  • Biao Zhang
  • Bingcong Jian
  • Xiangnan He
  • Jianxiang Cheng
  • Zechu Sun
  • Rong Wang
  • Zhe Chen
  • Ji Lin
  • Rui Xiao
  • Qingjiang Liu
  • Qi Ge

Related Research Unit(s)

Detail(s)

Original languageEnglish
Article numbereadl4387
Journal / PublicationScience Advances
Volume10
Issue number20
Online published15 May 2024
Publication statusPublished - May 2024

Link(s)

Abstract

4D printing enables 3D printed structures to change shape over "time" in response to environmental stimulus. Because of relatively high modulus, shape memory polymers (SMPs) have been widely used for 4D printing. However, most SMPs for 4D printing are thermosets, which only have one permanent shape. Despite the efforts that implement covalent adaptable networks (CANs) into SMPs to achieve shape reconfigurability, weak thermomechanical properties of the current CAN-SMPs exclude them from practical applications. Here, we report reconfigurable 4D printing via mechanically robust CAN-SMPs (MRC-SMPs), which have high deformability at both programming and reconfiguration temperatures (>1400%), high Tg (75°C), and high room temperature modulus (1.06 GPa). The high printability for DLP high-resolution 3D printing allows MRC-SMPs to create highly complex SMP 3D structures that can be reconfigured multiple times under large deformation. The demonstrations show that the reconfigurable 4D printing allows one printed SMP structure to fulfill multiple tasks.

Research Area(s)

Citation Format(s)

Reconfigurable 4D printing via mechanically robust covalent adaptable network shape memory polymer. / Li, Honggeng; Zhang, Biao; Ye, Haitao et al.
In: Science Advances, Vol. 10, No. 20, eadl4387, 05.2024.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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