TY - JOUR
T1 - Recent research advances in Pb-free solders
AU - Lai, Yi-Shao
AU - Tong, Ho-Ming
AU - Tu, King-Ning
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2009/3
Y1 - 2009/3
UR - https://www.scopus.com/pages/publications/61349195113
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-61349195113&origin=recordpage
U2 - 10.1016/j.microrel.2009.02.007
DO - 10.1016/j.microrel.2009.02.007
M3 - Editorial Preface
SN - 0026-2714
VL - 49
SP - 221
EP - 222
JO - Microelectronics Reliability
JF - Microelectronics Reliability
IS - 3
ER -