TY - GEN
T1 - Recent advances and applications of plasma immersion ion implantation
AU - Chu, Paul K.
PY - 2004
Y1 - 2004
N2 - Many new applications of plasma immersion ion implantation (PIII) have recently emerged. In addition to the surface modification and fabrication of conventional metallurgical and semiconductor materials and staictures by PIII, new areas such as biomedical materials engineering and plasma treatment of insulating materials have attracted much attention. In this paper, the progress of our recent research work of PIII on microelectronics, namely optical characteristics of hydrogen plasma implanted silicon and fabrication of novel silicon-on-insulator materials, are described. © 2004 IEEE.
AB - Many new applications of plasma immersion ion implantation (PIII) have recently emerged. In addition to the surface modification and fabrication of conventional metallurgical and semiconductor materials and staictures by PIII, new areas such as biomedical materials engineering and plasma treatment of insulating materials have attracted much attention. In this paper, the progress of our recent research work of PIII on microelectronics, namely optical characteristics of hydrogen plasma implanted silicon and fabrication of novel silicon-on-insulator materials, are described. © 2004 IEEE.
UR - http://www.scopus.com/inward/record.url?scp=21644472943&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-21644472943&origin=recordpage
M3 - RGC 32 - Refereed conference paper (with host publication)
VL - 3
SP - 2172
EP - 2177
BT - International Conference on Solid-State and Integrated Circuits Technology Proceedings, ICSICT
T2 - 7th International Conference on Solid-State and Integrated Circuits Technology (ICSICT 2004)
Y2 - 18 October 2004 through 21 October 2004
ER -