Abstract
We present an experimental study of the wetting behavior of Pb on flat and grooved Cu surfaces. The alloying of even 1–2 wt. % Sn into Pb can lead to dramatic changes in wetting angle and length flow into the grooves. The observed flow behavior disagrees with models based on the classical Washburn flow [E. W. Washburn, Phys. Rev. 17, 273 (1921)]. We conclude that the driving force of reactive wetting must take into account, besides the capillary force, the free energy change due to intermetallic compound formation. © 1998 The American Physical Society.
| Original language | English |
|---|---|
| Pages (from-to) | 6308-6311 |
| Journal | Physical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics |
| Volume | 58 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - Nov 1998 |
| Externally published | Yes |
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