Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Tian Tian
  • Feng Xu
  • Jung Kyu Han
  • Daechul Choi
  • Yin Cheng
  • Lukas Helfen
  • Marco Di Michiel
  • Tilo Baumbach

Detail(s)

Original languageEnglish
Article number082114
Journal / PublicationApplied Physics Letters
Volume99
Issue number8
Publication statusPublished - 22 Aug 2011
Externally publishedYes

Abstract

We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 104 A/cm2 and 7.5 103 A/cm2 at 125 C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages. © 2011 American Institute of Physics.

Bibliographic Note

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Citation Format(s)

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography. / Tian, Tian; Xu, Feng; Kyu Han, Jung; Choi, Daechul; Cheng, Yin; Helfen, Lukas; Di Michiel, Marco; Baumbach, Tilo; Tu, K. N.

In: Applied Physics Letters, Vol. 99, No. 8, 082114, 22.08.2011.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review