Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

Tian Tian; Feng Xu; Jung Kyu Han; Daechul Choi; Yin Cheng; Lukas Helfen; Marco Di Michiel; Tilo Baumbach; K. N. Tu

doi:10.1063/1.3628342

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

Tian Tian^*, Feng Xu, Jung Kyu Han, Daechul Choi, Yin Cheng, Lukas Helfen, Marco Di Michiel, Tilo Baumbach, K. N. Tu

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

22 Citations (Scopus)

Abstract

We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 10⁴ A/cm² and 7.5 10³ A/cm² at 125 C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages. © 2011 American Institute of Physics.

Original language	English
Article number	082114
Journal	Applied Physics Letters
Volume	99
Issue number	8
DOIs	https://doi.org/10.1063/1.3628342
Publication status	Published - 22 Aug 2011
Externally published	Yes

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@article{c626167fac174ee98b1e469bdba84275,

title = "Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography",

abstract = "We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 104 A/cm2 and 7.5 103 A/cm2 at 125 C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages. {\textcopyright} 2011 American Institute of Physics.",

author = "Tian Tian and Feng Xu and {Kyu Han}, Jung and Daechul Choi and Yin Cheng and Lukas Helfen and {Di Michiel}, Marco and Tilo Baumbach and Tu, {K. N.}",

year = "2011",

month = aug,

day = "22",

doi = "10.1063/1.3628342",

language = "English",

volume = "99",

journal = "Applied Physics Letters",

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publisher = "American Institute of Physics",

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TY - JOUR

T1 - Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

AU - Tian, Tian

AU - Xu, Feng

AU - Kyu Han, Jung

AU - Choi, Daechul

AU - Cheng, Yin

AU - Helfen, Lukas

AU - Di Michiel, Marco

AU - Baumbach, Tilo

AU - Tu, K. N.

PY - 2011/8/22

Y1 - 2011/8/22

N2 - We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 104 A/cm2 and 7.5 103 A/cm2 at 125 C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages. © 2011 American Institute of Physics.

AB - We performed a rapid diagnosis of electromigration induced void nucleation and growth in Pb-free flip chip solder joints. Quantitative measurements of the growth rate of voids during the stressing by 1.0 104 A/cm2 and 7.5 103 A/cm2 at 125 C were conducted by synchrotron radiation high resolution x-ray laminography. The results were analyzed by the statistical model of Weibull distribution function [W. Weibull, ASME Trans. J. Appl. Mech. 18(3), 293 (1951)] of lifetime data. The Johnson-Mehl-Avrami phase transformation theory is proposed to provide a physical link to the statistical model and to estimate the lifetime of the joints at early stages. © 2011 American Institute of Physics.

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UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-80052393368&origin=recordpage

U2 - 10.1063/1.3628342

DO - 10.1063/1.3628342

M3 - RGC 21 - Publication in refereed journal

SN - 0003-6951

VL - 99

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 8

M1 - 082114

ER -

Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography

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