Pulse electroplating of copper film: A study of process and microstructure

Xi Zhang, K. N. Tu, Zhong Chen, Y. K. Tan, C. C. Wong, S. G. Mhaisalkar, X. M. Li, C. H. Tung, C. K. Cheng

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review