Novel LTCC distributed-element wideband bandpass filter based on the dual-mode stepped-impedance resonator
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
---|---|
Article number | 7047779 |
Pages (from-to) | 372-380 |
Journal / Publication | IEEE Transactions on Components, Packaging and Manufacturing Technology |
Volume | 5 |
Issue number | 3 |
Publication status | Published - 1 Mar 2015 |
Link(s)
Abstract
In this paper, a novel compact 3-D dual-mode stepped-impedance resonator (SIR) with centrally loaded stub is constructed for designing a wideband low-temperature cofired ceramic (LTCC) bandpass filter (BPF). By fully taking advantage of the LTCC technology, the dual-mode SIR, as a cell unit of the proposed filter, is reasonably folded in 3-D environment, and its properties are investigated using the transmission line theory. Accordingly, benefiting from the 3-D circuit layout, the proposed BPF designed by combining the SIR and dual-mode techniques can effectively overcome a vital and common drawback of large circuit size of the LTCC distributed-element filters. For demonstration, a fourth-order wideband BPF centered at 5 GHz is designed, fabricated, and measured. The circuit size of the designed BPF has a compact size of 3.875 × 4.8 × 1.4 mm3. The impact of the package on the coupling and routing scheme and frequency response/transmission zero has been analyzed and demonstrated. The simulated and measured results are presented and compared, showing a good agreement.
Research Area(s)
- Dual-mode stepped-impedance resonator (SIR), low-temperature cofired ceramic (LTCC), miniaturization, transmission zero, wideband bandpass filter (BPF)
Citation Format(s)
Novel LTCC distributed-element wideband bandpass filter based on the dual-mode stepped-impedance resonator. / Chen, Jian-Xin; Zhan, Yang; Xue, Quan.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 3, 7047779, 01.03.2015, p. 372-380.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 3, 7047779, 01.03.2015, p. 372-380.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review