Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 3971-3973 |
Journal / Publication | Applied Physics Letters |
Volume | 79 |
Issue number | 24 |
Publication status | Published - 10 Dec 2001 |
Externally published | Yes |
Link(s)
Abstract
Enhanced dopant activation and elimination of end-of-range (EOR) defects in BF2+-implanted silicon-on-insulator (SOI) have been achieved by high-density current stressing. With the high-density current stressing, the implantation amorphous silicon underwent recrystallization, enhanced dopant activation and elimination of the (EOR) defects. The current stressing method allows the complete removal of EOR defects that has not been possible with conventional thermal annealing in the processing of high-performance SOI devices. © 2001 American Institute of Physics.
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Citation Format(s)
Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current. / Lin, H. H.; Cheng, S. L.; Chen, L. J. et al.
In: Applied Physics Letters, Vol. 79, No. 24, 10.12.2001, p. 3971-3973.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review