Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • H. H. Lin
  • S. L. Cheng
  • L. J. Chen
  • Chih Chen
  • K. N. Tu

Detail(s)

Original languageEnglish
Pages (from-to)3971-3973
Journal / PublicationApplied Physics Letters
Volume79
Issue number24
Publication statusPublished - 10 Dec 2001
Externally publishedYes

Abstract

Enhanced dopant activation and elimination of end-of-range (EOR) defects in BF2+-implanted silicon-on-insulator (SOI) have been achieved by high-density current stressing. With the high-density current stressing, the implantation amorphous silicon underwent recrystallization, enhanced dopant activation and elimination of the (EOR) defects. The current stressing method allows the complete removal of EOR defects that has not been possible with conventional thermal annealing in the processing of high-performance SOI devices. © 2001 American Institute of Physics.

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Citation Format(s)

Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current. / Lin, H. H.; Cheng, S. L.; Chen, L. J. et al.

In: Applied Physics Letters, Vol. 79, No. 24, 10.12.2001, p. 3971-3973.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review