Substrate integrated meandering probe-fed patch antennas for wideband wireless devices

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

Detail(s)

Original languageEnglish
Article number7046358
Pages (from-to)381-388
Journal / PublicationIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume5
Issue number3
Publication statusPublished - 1 Mar 2015

Abstract

This paper presents novel linearly polarized (LP) and circularly polarized (CP) patch antennas for wideband wireless devices. Advanced electrical characteristics of the antennas including wide bandwidth, low cross polarization, low back radiation, and polarization insensitivity contribute to improve the signal quality of wireless connectivity. It is a realization of antenna foundation by employing multilayer microwave laminates to form a substrate integrated meandering probe-fed patch antenna. First, a design and analysis of the proposed patch antenna for LP operation is carried out. Based on the obtained results of this LP element, a substrate integrated meandering probe fed CP patch antenna is exhibited afterward. This paper is considered as a part of RF modules that could be integrated with other components like sensors, Microcontroller units, and electronic parts to form a wireless product by means of conventional packaging process.

Research Area(s)

  • Antenna in package, low cross patch antenna, polarization, substrate integrated meandering probe, wideband antenna

Citation Format(s)

Substrate integrated meandering probe-fed patch antennas for wideband wireless devices. / Wong, Hang; Lin, Quan Wei; Lai, Hau Wah; Zhang, Xiu Yin.

In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 3, 7046358, 01.03.2015, p. 381-388.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review