Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu

Quan-Zhang An; Kai Feng; He-Ping Lü; Xun Cai; Tie-Tun Sun; Paul K. Chu

doi:10.1016/S1003-6326(15)63802-X

Author(s)

Quan-Zhang An
Kai Feng
He-Ping Lü
Xun Cai
Tie-Tun Sun

Detail(s)

Original language	English
Pages (from-to)	1944-1949
Journal / Publication	Transactions of Nonferrous Metals Society of China (English Edition)
Volume	25
Issue number	6
Publication status	Published - 1 Jun 2015

Link(s)

DOI	DOI https://doi.org/10.1016/S1003-6326(15)63802-X Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-84936967018&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(e0775c01-38e8-4194-bf77-1130ac5b2d43).html

Abstract

Al and N were introduced into copper substrate using plasma immersion ion implantation (PIII) in order to enhance its hardness and oxidation resistance. The dosage of N ion is 5×10¹⁶ cm^-2, and range of dosage of Al ion is 5×10¹⁶-2×10¹⁷ cm^-2. The oxidation tests indicate that the copper samples after undergoing PIII possess higher oxidation resistance. The degree of oxidation resistance is found to vary with implantation dosage of Al ion. The antibacterial tests also reveal that the plasma implanted copper specimens have excellent antibacterial resistance against Staphylococcus aureus, which are similar to pure copper.

Research Area(s)

antibacterial properties, copper, nanoindentation, oxidation resistance, plasma immersion ion implantation

Citation Format(s)

[ RIS ] [ BibTeX ]

Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu. / An, Quan-Zhang; Feng, Kai; Lü, He-Ping; Cai, Xun; Sun, Tie-Tun; Chu, Paul K.

In: Transactions of Nonferrous Metals Society of China (English Edition), Vol. 25, No. 6, 01.06.2015, p. 1944-1949.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

An, Q-Z, Feng, K, Lü, H-P, Cai, X, Sun, T-T & Chu, PK 2015, 'Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu', Transactions of Nonferrous Metals Society of China (English Edition), vol. 25, no. 6, pp. 1944-1949. https://doi.org/10.1016/S1003-6326(15)63802-X

An, Q-Z., Feng, K., Lü, H-P., Cai, X., Sun, T-T., & Chu, P. K. (2015). Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu. Transactions of Nonferrous Metals Society of China (English Edition), 25(6), 1944-1949. https://doi.org/10.1016/S1003-6326(15)63802-X

An Q-Z, Feng K, Lü H-P, Cai X, Sun T-T, Chu PK. Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu. Transactions of Nonferrous Metals Society of China (English Edition). 2015 Jun 1;25(6):1944-1949. https://doi.org/10.1016/S1003-6326(15)63802-X

An, Quan-Zhang ; Feng, Kai ; Lü, He-Ping ; Cai, Xun ; Sun, Tie-Tun ; Chu, Paul K. / Effects of Al and N plasma immersion ion implantation on surface microhardness, oxidation resistance and antibacterial characteristics of Cu. In: Transactions of Nonferrous Metals Society of China (English Edition). 2015 ; Vol. 25, No. 6. pp. 1944-1949.