Emerging Technology for in situ processing : Patterning Alternatives
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 895 |
| Journal / Publication | Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena |
| Volume | 6 |
| Issue number | 3 |
| Publication status | Published - May 1988 |
| Externally published | Yes |
Link(s)
| DOI | DOI |
|---|---|
| Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(ded3fe45-13bf-4622-a083-6a9251bcdd8a).html |
Abstract
In situ processing methods would permit fabrication of semiconductor devices by simplified methods and without exposure of surfaces to air, liquids, or a processing atmosphere shared with human operators. The principal alternative patterning methods which would replace current lithography in such schemes are reviewed briefly.
Citation Format(s)
Emerging Technology for in situ processing : Patterning Alternatives. / Ehrlich, D. J. ; Black, J. G. ; Rothschild, M. ; Pang, S. W.
In: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena, Vol. 6, No. 3, 05.1988, p. 895 .Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
