On the dielectric properties of substrates with different surface conditions for submillimeter-wave and terahertz applications
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
---|---|
Pages (from-to) | 45-59 |
Journal / Publication | Terahertz Science and Technology the international journal of Hz |
Volume | 9 |
Issue number | 2 |
Publication status | Published - Jun 2016 |
Link(s)
DOI | DOI |
---|---|
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(d519956b-c574-4243-aeb6-f8ef890a8396).html |
Abstract
Dielectric constant and loss tangent are essential material parameters in designing and predicting the
performance of submillimeter-wave and terahertz devices. In this paper we investigate dielectric properties of
substrate materials using pulsed time-domain spectroscopy. It is found that these dielectric properties depend on the
preparation process of the sample under test as different process results in different surface condition. Two different
substrates, namely, printed-circuit board laminate and 3D printing polymer, with different preparation methods are
used to illustrate the impact of surface condition of the sample to the extracted dielectric properties. A Fresnel
zone-plate lens with a circular grating reflecting plane operating at 0.3 THz is designed and measured. Good
agreement between simulation and measurement results is achieved when proper dielectric properties and surface
model are employed.
Citation Format(s)
On the dielectric properties of substrates with different surface conditions for submillimeter-wave and terahertz applications. / Ng, Kung Bo; Chan, Chi Hou.
In: Terahertz Science and Technology the international journal of Hz, Vol. 9, No. 2, 06.2016, p. 45-59.
In: Terahertz Science and Technology the international journal of Hz, Vol. 9, No. 2, 06.2016, p. 45-59.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review