Multiple scattering among vias in lossy planar waveguides using SMCG method
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal
Author(s)
Related Research Unit(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 181-188 |
| Journal / Publication | IEEE Transactions on Advanced Packaging |
| Volume | 25 |
| Issue number | 2 |
| Publication status | Published - May 2002 |
Link(s)
Abstract
Large-scale full-wave multiple scattering among cylindrical vias in planar waveguides is modeled using the Foldy-Lax equation. The formulation includes the skin effects of the conducting power/ground plane. Numerical solution of the Foldy-Lax equation with large number of unknowns is computed efficiently using the sparse-matrix canonical-grid method. In this method, interactions among vias are decomposed into the strong interactions part and the weak interactions part. The calculation of the weak part is carried out using two-dimensional (2-D)-fast Fourier transform (FFT) by translating the locations of the vias onto the uniform grids. The final solution of the Foldy-Lax equations is calculated by an iterative method. The results show O(N log N) CPU efficiency and O(N) memory efficiency. This makes large scale via problems possible for computer simulation.
Research Area(s)
- O(N log N), Skin effects, SMCG, Via
Citation Format(s)
Multiple scattering among vias in lossy planar waveguides using SMCG method. / Huang, Chung-Chi; Tsang, Leung; Chan, Chi H.
In: IEEE Transactions on Advanced Packaging, Vol. 25, No. 2, 05.2002, p. 181-188.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal
