Boosting the photoelectrochemical performance of bismuth vanadate photoanode through homojunction construction

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Detail(s)

Original languageEnglish
Pages (from-to)687-694
Number of pages8
Journal / PublicationJournal of Colloid and Interface Science
Volume646
Online published19 May 2023
Publication statusPublished - 15 Sept 2023

Abstract

The photoelectrochemical (PEC) performance of bismuth vanadate (BiVO4) suffers from sluggish charge mobility and substantial charge recombination losses due to its intrinsic defect. To rectify the problem, we developed a novel approach to prepare an n-n+ type II BVOac-BVOal homojunction with staggered band alignment. This architecture involves a built-in electric field that facilitating the electron-hole separation at the BVOac/BVOal interface. As a result, the BVOac-BVOal homojunction shows superior photocurrent density up to 3.6 mA/cm2 at 1.23 V vs. reversible hydrogen electrode (RHE) with 0.1 M sodium sulfite as the hole scavenger, which is 3 times higher than that of the single-layer BiVO4 photoanode. Unlike the previous efforts that modifying the PEC performance of BiVO4 photoanodes through incorporating heteroatoms, the highly-efficient BVOac-BVOal homojunction was achieved without incorporating any heteroatoms in this work. The remarkable PEC activity of the BVOac-BVOal homojunction highlights the tremendous importance of reducing the charge recombination rate at the interface by constructing the homojunction and offers an effective strategy to form the heteroatoms-free BiVO4 thin film as an efficient photoanode material for practical PEC applications.

© 2023 Elsevier Inc. All rights reserved.

Research Area(s)

  • BiVO4, Photoanode, Homojunction, Water splitting, Photoelectrochemical

Citation Format(s)

Boosting the photoelectrochemical performance of bismuth vanadate photoanode through homojunction construction. / Wang, Haipeng; Wang, Shuyun; Oo, May Thawda et al.
In: Journal of Colloid and Interface Science, Vol. 646, 15.09.2023, p. 687-694.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review