Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Title of host publication | Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) |
Publisher | Institute of Electrical and Electronics Engineers, Inc. |
Pages | 1257-1260 |
ISBN (print) | 9781479935086 |
Publication status | Published - 2014 |
Publication series
Name | |
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ISSN (Print) | 1084-6999 |
Conference
Title | 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 |
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Place | United States |
City | San Francisco, CA |
Period | 26 - 30 January 2014 |
Link(s)
Abstract
This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators. © 2014 IEEE.
Citation Format(s)
Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators. / Tu, Cheng; Lee, Joshua E.-Y.
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers, Inc., 2014. p. 1257-1260 6765877.
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Institute of Electrical and Electronics Engineers, Inc., 2014. p. 1257-1260 6765877.
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review