電子組件封裝用複合材料及其製造方法
电子组件封装用复合材料及其制造方法 (Electronic Packaging Polymeric Composite And Its Production Method)
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityU)
Author(s)
Detail(s)
| Original language | Chinese (Traditional) |
|---|---|
| Filing number | 202410642225.0 |
| Publication status |
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| Externally published | Yes |
Link(s)
| Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(a6bbea8e-d281-45a4-ad78-0cc6df134cb2).html |
|---|
Citation Format(s)
電子組件封裝用複合材料及其製造方法. / LIU, Yingxia (Inventor); WANG, Kaifeng (Inventor).
May 22, 2024.
May 22, 2024.
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityU)
