Eliminate Kirkendall voids in solder reactions on nanotwinned copper

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

66 Scopus Citations
View graph of relations

Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)241-244
Journal / PublicationScripta Materialia
Volume68
Issue number5
Publication statusPublished - Mar 2013
Externally publishedYes

Abstract

Electroplating was used to fabricate a high density of nanotwins that exhibited the preferred (1 1 1) orientation in Cu. We found no formation of Kirkendall voids in solder reactions on the nanotwinned Cu. This was due to the high density of steps and kinks on the nanotwin boundaries, which serve as vacancy sinks. Thus the vacancy concentration cannot reach supersaturation and nucleate voids. The finding is a significant advance in the problem of solder joint reliability in microelectronic three-dimensional integrated circuit devices. © 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Research Area(s)

  • Copper, Diffusion, Kirkendall voids, Nanostructured materials, Twinning

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.

Citation Format(s)

Eliminate Kirkendall voids in solder reactions on nanotwinned copper. / Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning.

In: Scripta Materialia, Vol. 68, No. 5, 03.2013, p. 241-244.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review