Three-dimensional nanosprings for electromechanical sensors

This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures with nanoscale features that can be used for electromechanical sensors. The process uses conventional microfabrication techniques to create a planar pattern in a SiGe/Si bilayer that then self-assembles into 3D structures during a wet etch release. An additional metal layer can be integrated for higher conductivity. Results from the fabrication of the structures are demonstrated. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical and electrical characterization. The experimental characterization results were validated by finite element simulation.