Improved back stress and synergetic strain hardening in coarse-grain/nanostructure laminates

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Yanfei Wang
  • Muxin Yang
  • Mingsai Wang
  • Kun Yin
  • Aihui Huang
  • Chongxiang Huang

Detail(s)

Original languageEnglish
Pages (from-to)113-118
Journal / PublicationMaterials Science and Engineering A
Volume727
Publication statusPublished - 6 Jun 2018
Externally publishedYes

Abstract

The effect of back stress on the mechanical behaviors of heterogeneous material is studied in two modeled heterogeneous laminates, i.e. laminated structure with a nanostructured (NS) Cu-Zn alloy layer sandwiched between two coarse-grained (CG) pure Cu layers. The improved tensile ductility of NS layer is revealed and attributed to the constraint from the stable CG layers. It is found that the elastic/plastic interaction between NS and CG layers is capable of significantly improving the back stress, which makes a significant contribution to the synergetic strain hardening in low strain stage. Furthermore, a higher mechanical incompatibility permits stronger and longer mutual interaction between layers, i.e. coupling effect, which contributes to a higher back stress. These results improve our understanding about the role of back stress on mechanical behaviors of heterogeneous laminate materials.

Research Area(s)

  • Back stress, Elastic/plastic interaction, Laminate, Nanostructure, Strain hardening

Bibliographic Note

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Citation Format(s)

Improved back stress and synergetic strain hardening in coarse-grain/nanostructure laminates. / Wang, Yanfei; Yang, Muxin; Ma, Xiaolong et al.
In: Materials Science and Engineering A, Vol. 727, 06.06.2018, p. 113-118.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review