Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

5 Scopus Citations
View graph of relations


  • Albert T. Wu
  • N. Tamura
  • J. R. Lloyd
  • C. R. Kao
  • K. N. Tu


Original languageEnglish
Article numberB9.10
Pages (from-to)363-367
Journal / PublicationMaterials Research Society Symposium Proceedings
Publication statusPublished - 2005
Externally publishedYes


Title2005 Materials Research Society Spring Meeting
PlaceUnited States
CitySan Francisco, CA
Period28 March - 1 April 2005


White Sn (ß-Sn) thin film stripe shows a voltage drop about 10% when subjected to electromigration testing. Since ß-Sn has anisotropic crystal structure, it possesses different resistivity along a-, b- and c axis. The direction of the axes determines the resistance in each grain. Under electromigration, low resistance grain tends to grow in the expense of the neighboring high resistance grains. The changes of grain orientation in the Sn stripe before and after electromigration was studied by synchrotron x-ray microdiffraction (~lnm diameter) to achieve grain-by-grain analysis. Grain growth involves grain boundary migration and rotation of neighboring high resistance grains. A model different from normal grain growth is proposed to describe the condition and mechanism of microstructural evolution under electromigration. © 2005 Materials Research Society.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to

Citation Format(s)