Conductive nanolamellar Cu/martensite wire with high strength
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 344-347 |
Journal / Publication | Materials Letters |
Volume | 229 |
Publication status | Published - 15 Oct 2018 |
Externally published | Yes |
Link(s)
Abstract
Cu wires can be significantly strengthened without losing much conductivity if a continuous nanolamellar structure with Cu and a strong second constituent is achieved. We report on a nanolamellar Cu/steel wire fabricated by repetitive hot-pressing, forging, rolling and subsequent wire drawing. Austenization and quenching in liquid nitrogen resulted in a Cu/martensite structure, exhibiting tensile strength of 1220 MPa. The electrical conductivity of the wire was measured to be about 60% International Annealed Copper Standard (IACS), which was comparable with Cu/Fe fabricated by alloying and casting. In situ tensile tests under high energy X-ray diffraction were utilized to explore the deformation behavior of the wire. It was found that the martensite carried about 60% of the load, accounting for the high strength.
Research Area(s)
- High strength and conductivity, In situ synchrotron X-ray diffraction, Martensite, Multilayer structure, Nanocomposites
Bibliographic Note
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Citation Format(s)
Conductive nanolamellar Cu/martensite wire with high strength. / Ru, Yadong; Yu, Kaiyuan; Guo, Fangmin et al.
In: Materials Letters, Vol. 229, 15.10.2018, p. 344-347.
In: Materials Letters, Vol. 229, 15.10.2018, p. 344-347.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review