Robust and area-efficient nLDMOS-SCR with waffle layout structure for high-voltage ESD protection
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 1629-1630 |
Journal / Publication | Electronics Letters |
Volume | 48 |
Issue number | 25 |
Publication status | Published - 6 Dec 2012 |
Externally published | Yes |
Link(s)
Abstract
A novel waffle-type nLDMOS-SCR ESD clamp with compact source and drain for high-voltage ESD protection is proposed and realised using the 0.35 m, 30/5 V bipolar-CMOS-DMOS (BCD) process. With this new structure, a high ESD failure current of 4.4 A was achieved with a total channel width of only 60 m. Considering the area efficiency, the waffle-type structure provides more than 30% higher current handling capability than the conventional ones. Because of its better robustness and area efficiency, the waffle-type structure should be a promising layout for high-voltage ESD protection applications. © 2012 The Institution of Engineering and Technology.
Citation Format(s)
Robust and area-efficient nLDMOS-SCR with waffle layout structure for high-voltage ESD protection. / Zheng, J.; Han, Y.; Wong, H. et al.
In: Electronics Letters, Vol. 48, No. 25, 06.12.2012, p. 1629-1630.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review