Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration'" [Appl. Phys. Lett. 79, 1061 (2001)]
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Comment/debate
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Journal / Publication | Applied Physics Letters |
| Volume | 79 |
| Issue number | 7 |
| Publication status | Published - 13 Aug 2001 |
| Externally published | Yes |
Link(s)
Bibliographic Note
Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to lbscholars@cityu.edu.hk.
Citation Format(s)
Response to "Comment on 'Effect of current crowding on vacancy diffusion and void formation in electromigration'" [Appl. Phys. Lett. 79, 1061 (2001)]. / Tu, K. N.
In: Applied Physics Letters, Vol. 79, No. 7, 13.08.2001.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Comment/debate
