MOTIVES FOR GOING PUBLIC AND UNDERPRICING : NEW FINDINGS FROM KOREA

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

Overview

39 Scopus Citations

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Author(s)

JEONG‐BON KIM
ITZHAK KRINSKY
JASON LEE

Detail(s)

Original language	English
Pages (from-to)	195-211
Journal / Publication	Journal of Business Finance & Accounting
Volume	20
Issue number	2
Publication status	Published - Jan 1993
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1111/j.1468-5957.1993.tb00659.x Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-84896353750&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(537f3418-626c-4bc3-8f83-814f718ab154).html

Citation Format(s)

[ RIS ] [ BibTeX ]

MOTIVES FOR GOING PUBLIC AND UNDERPRICING : NEW FINDINGS FROM KOREA. / KIM, JEONG‐BON; KRINSKY, ITZHAK; LEE, JASON.

In: Journal of Business Finance & Accounting, Vol. 20, No. 2, 01.1993, p. 195-211.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

KIM, JEONGBON, KRINSKY, ITZHAK & LEE, JASON 1993, 'MOTIVES FOR GOING PUBLIC AND UNDERPRICING: NEW FINDINGS FROM KOREA', Journal of Business Finance & Accounting, vol. 20, no. 2, pp. 195-211. https://doi.org/10.1111/j.1468-5957.1993.tb00659.x

KIM, JEONGBON., KRINSKY, ITZHAK., & LEE, JASON. (1993). MOTIVES FOR GOING PUBLIC AND UNDERPRICING: NEW FINDINGS FROM KOREA. Journal of Business Finance & Accounting, 20(2), 195-211. https://doi.org/10.1111/j.1468-5957.1993.tb00659.x

KIM JEONGBON, KRINSKY ITZHAK, LEE JASON. MOTIVES FOR GOING PUBLIC AND UNDERPRICING: NEW FINDINGS FROM KOREA. Journal of Business Finance & Accounting. 1993 Jan;20(2):195-211. https://doi.org/10.1111/j.1468-5957.1993.tb00659.x

KIM, JEONG‐BON ; KRINSKY, ITZHAK ; LEE, JASON. / MOTIVES FOR GOING PUBLIC AND UNDERPRICING : NEW FINDINGS FROM KOREA. In: Journal of Business Finance & Accounting. 1993 ; Vol. 20, No. 2. pp. 195-211.