Spalling of Cu-Sn compound spheroids in solder joints on Si wafers

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)27-30
Journal / PublicationMaterials Research Society Symposium - Proceedings
Publication statusPublished - 1997
Externally publishedYes


TitleProceedings of the 1996 MRS Fall Symposium
CityBoston, MA, USA
Period3 - 5 December 1996


In reacting eutectic SnPb solder with Ti/Cu and Cr/Cu/Au thin film metallization on Si wafers, we have observed spalling of Cu6Sn5 spheroids when the solder consumes the Cu. The formation of the spheroids is assisted by the ripening reaction among the compound grains. In addition we have observed an asymmetric spalling phenomenon using a sandwich structure, in which two wafers were soldered face-to-face. The spalling occurs predominantly at the interface below the solder joint. It suggests that gravity plays a role.

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