Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

Li Pu; Yingxia Liu; Yong Yang; Quanfeng He; Ziqing Zhou; Xiuchen Zhao; Chengwen Tan; K.N. Tu

doi:10.1016/j.matlet.2020.127891

Author(s)

Li Pu
Xiuchen Zhao
Chengwen Tan

Related Research Unit(s)

Detail(s)

Original language	English
Article number	127891
Journal / Publication	Materials Letters
Volume	272
Online published	28 Apr 2020
Publication status	Published - 1 Aug 2020

Link(s)

DOI	DOI https://doi.org/10.1016/j.matlet.2020.127891 Final Published version
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Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-85089431185&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(45fe0180-0264-4bec-b6ef-327062d6f8cc).html

Abstract

Wetting reactions of the medium entropy alloy of SnBiIn and SnBiInAg on Cu substrate have been investigated. The melting points of both SnBiIn and SnBiInAg are about 80 ºC. The reactions were performed at 120 ºC, 140 ºC, and 160 ºC. The kinetics of interfacial intermetallic compound (IMC) growth of Cu₆Sn₅ was studied to be ripening-controlled with activation energy about 11.1 kJ/mol for SnBiIn and 10.4 kJ/mol for SnBiInAg. However, the addition of Ag has effectively reduced the IMC growth by 20-30%. We propose that it is because Ag has reduced the pre-factor of diffusivity by increasing the entropy of the alloy. (C) 2020 Elsevier B.V. All rights reserved.