Three-dimensional metal patterning over nanostructures by reversal imprint

C. Peng; B. L. Cardozo; S. W. Pang

doi:10.1116/1.2897319

Author(s)

C. Peng
B. L. Cardozo
S. W. Pang

Detail(s)

Original language	English
Pages (from-to)	632-635
Journal / Publication	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	26
Issue number	2
Publication status	Published - 2008
Externally published	Yes

Link(s)

DOI	DOI https://doi.org/10.1116/1.2897319 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-41549142717&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(44014c7c-bf66-4d2b-9f1c-0c9a0782f97a).html

Abstract

Reversal imprint is used to pattern three-dimensional (3D) metal structures over substrates with complex topography. Metal films are deposited onto SU-8 polymer layers on glass molds, lithographically patterned, and transferred to Si or SU-8 substrates with nanosctructured surfaces by reversal imprint at 5 MPa, 80 °C, and 1 s of UV exposure. The transfer of metal patterns of 5020 nm thick AuTi and 0.5 μm thick Al as well as 3D Al structures have been demonstrated. © 2008 American Vacuum Society.

Citation Format(s)

[ RIS ] [ BibTeX ]

Three-dimensional metal patterning over nanostructures by reversal imprint. / Peng, C.; Cardozo, B. L.; Pang, S. W.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 26, No. 2, 2008, p. 632-635.

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Peng, C, Cardozo, BL & Pang, SW 2008, 'Three-dimensional metal patterning over nanostructures by reversal imprint', Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, vol. 26, no. 2, pp. 632-635. https://doi.org/10.1116/1.2897319

Peng, C., Cardozo, B. L., & Pang, S. W. (2008). Three-dimensional metal patterning over nanostructures by reversal imprint. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 26(2), 632-635. https://doi.org/10.1116/1.2897319

Peng C, Cardozo BL, Pang SW. Three-dimensional metal patterning over nanostructures by reversal imprint. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2008;26(2):632-635. doi: 10.1116/1.2897319

Peng, C. ; Cardozo, B. L. ; Pang, S. W. / Three-dimensional metal patterning over nanostructures by reversal imprint. In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2008 ; Vol. 26, No. 2. pp. 632-635.