Boosting the Quality Factor of Low Impedance VHF Piezoelectric-on-Silicon Lateral Mode Resonators Using Etch Holes
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Title of host publication | Procedia Engineering |
Publisher | ELSEVIER |
Pages | 1261-1264 |
Volume | 168 |
ISBN (print) | 1877-7058 |
Publication status | Published - Oct 2016 |
Publication series
Name | |
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ISSN (Print) | 1877-7058 |
Conference
Title | 30th Eurosensors Conference, Eurosensors 2016 |
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Place | Hungary |
City | Budapest |
Period | 4 - 7 September 2016 |
Link(s)
DOI | DOI |
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Attachment(s) | Documents
Publisher's Copyright Statement
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Link to Scopus | https://www.scopus.com/record/display.uri?eid=2-s2.0-85010000298&origin=recordpage |
Permanent Link | https://scholars.cityu.edu.hk/en/publications/publication(181aec83-c545-4d93-bbb5-e51ce7bd8d44).html |
Abstract
We report a unique method of using etch-holes to greatly improve the unloaded quality factor (Qu) of VHF-band low impedance laterally vibrating AlN Thin-film Piezoelectric-on-Silicon (TPoS) MEMS resonators. We have validated the proposed method experimentally by applying it to fabricated devices with resonant frequencies of 105 MHz. Based on the experimental results of several fabricated samples, we show that the quality factors of the resonators consistently improve by almost four times using the proposed method. The experimental results are corroborated by finite-element (FE) simulations, which show that the holes re-distribute the strain energy in the resonator and suppress the movement in the supporting beam tethers. Less energy in the tethers leads to reduction of anchor loss and thus enhances Qu.
Research Area(s)
- anchor loss, etch holes, Piezoelectric-on-silicon resonators
Citation Format(s)
Boosting the Quality Factor of Low Impedance VHF Piezoelectric-on-Silicon Lateral Mode Resonators Using Etch Holes. / Tu, C.; Lee, J. E.-Y.
Procedia Engineering. Vol. 168 ELSEVIER, 2016. p. 1261-1264.
Procedia Engineering. Vol. 168 ELSEVIER, 2016. p. 1261-1264.
Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
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