Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  • Y.Y. Qiao
  • N. Zhao
  • C.Y. Liu
  • Y.P. Wang
  • H.T. Ma


Original languageEnglish
Article number100928
Journal / PublicationMaterials Today Communications
Online published14 Jan 2020
Publication statusPublished - Jun 2020


The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu6Sn5 grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 °C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu6Sn5 grains on (001)Cu substrate and mixed-type Cu6Sn5 grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu6Sn5 grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu6Sn5 grain pair.

Research Area(s)

  • 3D packaging, Electronic materials, Intermetallic alloys and compounds, Prism-type, Single crystal, Temperature gradient