Performance enhancement of microwave circuits using parallel-strip line

Research output: Journal Publications and ReviewsRGC 22 - Publication in policy or professional journal

11 Scopus Citations
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Original languageEnglish
Article number5568168
Pages (from-to)16-21
Journal / PublicationIEEE Potentials
Volume29
Issue number5
Publication statusPublished - Sept 2010

Abstract

Nowadays, demands for compactness, light weight, and broadband have a great impact on design issues at both component and system levels in wireless communications. Multilayered structures fabricated with low-temperature cofire ceramic (LTCC) technologies have been developed recently in response to these demands. With this trend, double-sided printed circuits using conventional fabrication techniques with lower cost have been receiving plenty of attention. © 2010 IEEE.

Citation Format(s)

Performance enhancement of microwave circuits using parallel-strip line. / Chiu, Leung; Xue, Quan; Chan, Chi.
In: IEEE Potentials, Vol. 29, No. 5, 5568168, 09.2010, p. 16-21.

Research output: Journal Publications and ReviewsRGC 22 - Publication in policy or professional journal