Performance enhancement of microwave circuits using parallel-strip line
Research output: Journal Publications and Reviews › RGC 22 - Publication in policy or professional journal
Author(s)
Related Research Unit(s)
Detail(s)
Original language | English |
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Article number | 5568168 |
Pages (from-to) | 16-21 |
Journal / Publication | IEEE Potentials |
Volume | 29 |
Issue number | 5 |
Publication status | Published - Sept 2010 |
Link(s)
Abstract
Nowadays, demands for compactness, light weight, and broadband have a great impact on design issues at both component and system levels in wireless communications. Multilayered structures fabricated with low-temperature cofire ceramic (LTCC) technologies have been developed recently in response to these demands. With this trend, double-sided printed circuits using conventional fabrication techniques with lower cost have been receiving plenty of attention. © 2010 IEEE.
Citation Format(s)
Performance enhancement of microwave circuits using parallel-strip line. / Chiu, Leung; Xue, Quan; Chan, Chi.
In: IEEE Potentials, Vol. 29, No. 5, 5568168, 09.2010, p. 16-21.
In: IEEE Potentials, Vol. 29, No. 5, 5568168, 09.2010, p. 16-21.
Research output: Journal Publications and Reviews › RGC 22 - Publication in policy or professional journal